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Automatic Loading And Unloading Wafer Laser Dicing Machine
Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced fragmentation rate
Widely used in scribing and cutting of integrated circuit wafers, GPP wafers and slotting and cutting of Low-K materials
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Automatic Loading And Unloading Wafer Slotting Machine
The equipment is widely used in the scribing and cutting of integrated circuit wafers and GPP wafers and the slotting and cutting of Low-K materials
Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced fragmentation rate
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FPC/PCB Picosecond UV Cutting Machine
It is widely used in mobile phone industry, communication, consumer electronics, semiconductor, scientific research, biomedicine and other fields. For example, laser precision cutting, drilling, and etching processing of non-metallic composite materials such as flexible OLED screens, LCP, PI films, FPC, nano-gold, polarizers, and FPC cover films.
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Multi-head Silver Paste ITO Etching Machine
Capacitive touch panel, capacitive screen wire and visible area etching, PET/PC/PMMA/ and glass substrates on the silver paste, ITO, graphene, nano-silver, carbon nanotubes, polymer conductive film and other materials high-speed direct writing etching processing
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Film Cutting Machine
It adopts the sealed-off CO2 metal-encapsulated radio frequency laser, with a working life of more than 45,000 hours, and can be used in a cycle.
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Infrared Picosecond Laser Wire Cutting Machine
The equipment is suitable for straight line or special-shaped cutting of ordinary glass or chemically strengthened glass. Mainly used in mobile phone glass cover, ultra-narrow bezel LCD, OLED, LTPS and other display panel glass, as well as glass slides in the medical industry, architectural glass, automotive glass and other industries.
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Infrared Picosecond Laser Glass Drilling Machine
Widely used in smartphone glass cutting, tablet glass cutting, LCD TV glass panel cutting, and other industries
The laser adopts picosecond laser, which has small cutting edge chipping, high strength after cutting, and small heat-affected area
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Fully Automatic Wafer Splitter
It is widely used in the splitting of integrated circuit wafers and GPP wafers.
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Silver Paste ITO Etching Machine
Capacitive touch panel, capacitive screen wire and visible area etching, PET/PC/PMMA/ and glass substrates on the silver paste, ITO, graphene, nano-silver, carbon nanotubes, polymer conductive film and other materials high-speed direct writing etching processing.
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Green-light Laser Glass Drilling Machine
It is suitable for drilling and cutting all kinds of glass in optoelectronics, flat panel display, mobile phone, semiconductor, medical, home appliance, solar energy, construction, automobile and other industries.
Sub-picosecond laser cutting chipping ≤ 40um, processing size: 0.1mm-90mm.
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Wafer Laser Back Cutting Machine
The equipment is widely used in the scribing and cutting of GPP wafers
This equipment is an automatic slicing equipment mainly developed for GPP wafers, equipped with double-sided CCD recognition function
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Wafer Laser Cutting Machine
This equipment is widely used in the scribing and cutting of integrated circuit wafers, GPP wafers and TVS wafers.
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UV Laser Cutting Machine
This equipment is used for flexible circuit board (FPC) cutting/ultra-thin metal cutting, cover film cutting; laser drilling micro-holes, LTCC drilling, etc.; fingerprint module (COB) cutting of PCB molding after surface mounting; golden finger repair / gold penetration elimination / pad repair; Sd card cutting.
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Laser Stealth Cutting Equipment
Cutting of coated glass (filter) for camera industry.
It is used in linear processing of thin glass or transparent materials in electronics, medical, display and other industries.
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Laser Trimming Machine
It is mainly used in the precision adjustment of thick film and thin film circuits. Widely used in thick film hybrid integrated circuits, electronic components, automotive circuits, sensors, military scientific research, chip resistors and other industries.
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Fully Automatic Wafer High-speed Dicing Machine
Widely used in integrated circuit wafers, wafer half-cutting and dicing
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Contact us
400-885-0505
Company Address
No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park
Website
Douyin
