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Wafer Laser Cutting Machine

This equipment is widely used in the scribing and cutting of integrated circuit wafers, GPP wafers and TVS wafers.
Laser power:
5W-30W
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Wafer Laser Cutting Machine
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Number of views:
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Wafer Laser Cutting Machine

This equipment is widely used in the scribing and cutting of integrated circuit wafers, GPP wafers and TVS wafers.
Retail price
0.0
元
Market price
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元
Number of views:
1000
Product serial number
Category
Laser precision machining
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Product description
Specifications
Sample display
Laser power:
5W-30W

Features: 

 

» Fast dicing speed, high efficiency, high chip yield
» Non-contact processing, no mechanical stress, high chip quality
» CCD fast positioning function, real-time coaxial monitoring or side axis monitoring function
» High-precision two-dimensional linear motion platform, High-precision DD rotary platform
» Marble abutment, stable and reliable, small thermal deformation
» Scribing process expert system
» High reliability and stability
» Equipped with automatic splitting equipment, easy to operate and high efficiency

We could not find any corresponding parameters, please add them to the properties table

Specifications: 

 

Device model TH-5212 TH-5221 TH-5210
laser type Infrared IR Infrared IR Ultraviolet UV
Laser wavelength 1064nm 1064nm 355nm
laser power 20w/30w 20w/30w 5w/10w/17w
Processing Wafer Size 5 inches (compatible with 6 inches) 4 inch 4 inch
Scribing speed 150mm/s、200mm/s 150mm/s、200mm/s 30mm/s、60mm/s、100mm/s
line width 35~45μm 40~50μm 20~30μm
Line depth < 120μm (depending on material) 50 -120μm 50-100μm
System positioning accuracy ±5μm ±5μm ±5μm
Repeatability ±2μm ±2μm ±2μm
Laser service life 100,000 hours 100,000 hours 12,000 hours
Equipment size 960*730*1740mm 960*730*1740mm 960*730*1740mm
Total Weight 660kg 660kg 660kg

 

Sample display: 

 

Wafer Tangent Sample

Wafer Tangent Sample

Motor stator welding sample

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No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park

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