Wafer Die Appearance Inspection Machine

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400-885-0505

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400-885-0505

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No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park

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technical specifications	TH-LV-01
laser	/
processing speed	100-150K/H
Field of application	After the wafer is cracked, the appearance inspection of the shot
Loading and unloading method	Oscillating plate feeding, high-frequency blowing and unloading
Detection speed	100-150K/H
camera frame rate	120fps
false positive rate	≤1%
camera configuration	Upper and lower double CCD
θ axis	360 degrees
Processing size	40-160mil
detection function	1. The outer ring is defective;
	2. Grain size;
	3. Brightness difference;
	4. Cutting deviation;
	5. Glass defects;