Fully Automatic Wafer High-speed Dicing Machine

Widely used in integrated circuit wafers, wafer half-cutting and dicing

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Fully Automatic Wafer High-speed Dicing Machine
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    technical specifications Wafer back cutting machine Fully automatic wafer tangent machine Fully automatic wafer back cutting machine
    laser IPG20W/30W
    processing speed 150-200mm/s
    Field of application Wafer half dicing
    Loading and unloading method artificial Fully automatic module Fully automatic module
    Scribing speed 150mm/s-200mm/s 150mm/s 150mm/s-200mm/s
    cutting depth ≤120um ≤120um ≤120um
    Counterpoint artificial template matching template matching
    visual processing Coarse positioning grayscale processing Binarization
    X\Y axis moving range 140mm 140mm 140mm
    θ axis 270 deg 360 degrees 270 deg
    platform level 5-15um 5-15um 5-15um
    laser Raycus 30W/IPG20, 30W IPG20、30W Raycus 30W/IPG20, 30W

     

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