Features: 

» This equipment is mainly developed for GPP wafers as an automatic splitting device; it is equipped with automatic loading and unloading, Z-axis pressure sensing, visual angle correction, double-wafer detection, and automatic liquid spraying functions; » The equipment has high mechanical yield and fast splitting
efficiency ;
» Full Chinese operation interface, intuitive and simple operation, good interface;
» Process parameters can be stored and retrieved, easy to operate;
» Pressure value sensing, graph display;
» Automatic draining system.