Automatic Loading And Unloading Wafer Slotting Machine

The equipment is widely used in the scribing and cutting of integrated circuit wafers and GPP wafers and the slotting and cutting of Low-K materials
Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced fragmentation rate

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Automatic Loading And Unloading Wafer Slotting Machine
  • Product description
  • Specifications
  • Sample display

    Product description: 

     

    » Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced chipping rate »
    Non-contact processing, no mechanical stress, high chip quality
    » CCD fast positioning function, double-sided CCD recognition function can be upgraded
    » Marble base Taiwan, stable and reliable, small thermal deformation
    » Scribing process with specialized system
    » Wafer back scribing with cross alignment line function
    » Equipped with automatic splitting equipment, easy to operate and high efficiency

     

     

     

  • Specifications: 

     

    Device model TH-8211 TH-8212
    laser type Ultraviolet UV Ultraviolet UV
    Laser wavelength 355nm 355nm
    laser power 10w/15w/30w 10w/15w/30w
    Processed wafer size upper limit 5 inches (compatible with 6 inches) 5 inches (compatible with 6 inches)
    Scribing speed 1000/1500/3000mm/s 50/80/100mm/s
    line width 150-300μm 20-40μm
    Line depth < 10μm (depending on material) < 120μm (depending on material)
    System positioning accuracy ±5μm ±5μm
    Repeatability ±2μm ±2μm
    Laser service life 12,000 hours 12,000 hours
    Machine Dimensions 1260*1160*1820mm 1260*1160*1820mm
    Total Weight 1500kg 1500kg

     

  • Sample display:

     

    Wafer Grooving Sample

    Wafer Grooving Sample

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