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Automatic Loading And Unloading Wafer Laser Dicing Machine

Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced fragmentation rate
Widely used in scribing and cutting of integrated circuit wafers, GPP wafers and slotting and cutting of Low-K materials
Laser power:
20w/30w
Processing format:
5 inch (6inch compatible)
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Automatic Loading And Unloading Wafer Laser Dicing Machine
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Number of views:
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Automatic Loading And Unloading Wafer Laser Dicing Machine

Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced fragmentation rate
Widely used in scribing and cutting of integrated circuit wafers, GPP wafers and slotting and cutting of Low-K materials
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Number of views:
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Laser precision machining
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Product description
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Laser power:
20w/30w
Processing format:
5 inch (6inch compatible)

Product description: 

 

» This equipment is mainly developed for GPP wafers as an automatic slicing equipment, equipped with double-sided CCD recognition function
» The lower CCD function solves the process that traditional equipment needs to etch line grooves on the back of the wafer for alignment cutting, and can cut without grooves on the back
» At the same time, it can be integrated with the function of CCD aligning wafer back etching line slot cutting, one machine with two purposes
» Equipped with automatic splitting equipment, easy to operate and high efficiency
» The equipment is widely used in scribing and cutting of GPP wafers

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Specifications: 

 

Device model TH-6212
laser type Infrared IR
Laser wavelength 1064nm
laser power 20w/30w
Maximum Processed Wafer Size 5 inches (compatible with 6 inches)
Scribing speed 150mm/s、200mm/s
line width 35~45μm
Line depth < 120μm (depending on material)
System positioning accuracy ±5μm
Repeatability ±2μm
Laser service life 100,000 hours
Machine Dimensions 960*730*1740mm
Total Weight 660kg

 

Sample display:

 

Wafer Tangent Sample

Wafer Tangent Sample

Motor stator welding sample

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No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park

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