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Green-light Laser Glass Drilling Machine

It is suitable for drilling and cutting all kinds of glass in optoelectronics, flat panel display, mobile phone, semiconductor, medical, home appliance, solar energy, construction, automobile and other industries.
Sub-picosecond laser cutting chipping ≤ 40um, processing size: 0.1mm-90mm.
Laser power:
10w 12w 20w 30w optional
Processing format:
50mm×50mm
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Green-light Laser Glass Drilling Machine
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Number of views:
1000

Green-light Laser Glass Drilling Machine

It is suitable for drilling and cutting all kinds of glass in optoelectronics, flat panel display, mobile phone, semiconductor, medical, home appliance, solar energy, construction, automobile and other industries.
Sub-picosecond laser cutting chipping ≤ 40um, processing size: 0.1mm-90mm.
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Number of views:
1000
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Product description
Specifications
Sample display
Laser power:
10w 12w 20w 30w optional
Processing format:
50mm×50mm

Features: 

 

» The machine has a compact structure, takes up little space, and is easy to use. Smaller and more flexible.
» Basic configuration, using imported lasers from Europe and America, combined with a 3D dynamic focusing galvanometer scanning system, the processing speed can reach 40mm/s and the cutting edge chipping is ≤70 um. Sub-picosecond laser cutting chipping ≤ 40um, processing size: 0.1mm-90mm.
» Intelligent CCD vision system, automatic fool-proof recognition, precise positioning calibration, equipment CCD can be used for visual inspection 
» Glass laser processing system control core, laser cutting system is built on the Windows 7 platform, stable performance, easy to use, and can be upgraded at any time according to customer needs. It can process all kinds of through holes, blind square holes, array holes, etc.
» Directly edit or import the cutting program, automatic counting function, set the cutting quantity at will and count the total number of cut products.

We could not find any corresponding parameters, please add them to the properties table
Device model TH-G-LD-30
Effective travel of machine tool cutting 500×500(mm)
Processing positioning method CCD positioning
Laser wavelength 532nm
laser power 10w 12w 20w 30w optional
Repeatability 0.005mm
positioning accuracy ±0.01mm
Chipping ≤ 70um
Borehole diameter lower limit 0.1mm
Single field lens cutting format 50mm×50mm
Glass thickness range ≤ 6mm
Total Weight 2300kg
Machine Dimensions 1540x1460x1752mm

 

Sample display:

 

Glass Drilled Sample

Glass Drilled Sample

Glass Drilled Sample

Contact us

Company address

No. 66, Tonghe Road, Weiting Town, Suzhou Industrial Park

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