Automatic loading and unloading wafer laser dicing machine

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Automatic loading and unloading wafer laser dicing machine
  • Product description
  • Specifications

    Features: 

     

    » This equipment is mainly developed for GPP wafers as an automatic slicing equipment, equipped with double-sided CCD recognition function
    » The lower CCD function solves the process that traditional equipment needs to etch line grooves on the back of the wafer for alignment cutting, and can cut without grooves on the back
    » At the same time, it can be integrated with the function of CCD aligning wafer back etching line slot cutting, one machine with two purposes
    » Equipped with automatic splitting equipment, easy to operate and high efficiency
    » The equipment is widely used in scribing and cutting of GPP wafers

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Automatic loading and unloading laser wafer slotting equipment