Features: 

» Fully automatic loading and unloading, automatic alignment, fast scribing speed, high efficiency, and reduced chipping rate »
Non-contact processing, no mechanical stress, high chip quality
» CCD fast positioning function, double-sided CCD recognition function can be upgraded
» High precision Two-dimensional linear motion platform, high-precision DD rotary platform
» Marble base, stable and reliable, small thermal deformation
» Cross alignment line marking function on the back of the wafer
» Equipped with automatic splitting equipment, easy to operate and high efficiency