Features: 

» Use the control system to control the movement of the laser according to the trajectory of the electronic circuit, project the laser onto the injection-molded three-dimensional plastic device, and use the laser to activate the material in a short time-the laser makes the metal structure compound in the plastic containing the dopant Separation (laser activation). The metal atoms exposed after laser activation are used as the seed layer of the electroless plating process. During the electroless plating process, the activated area can grow a metal layer (surface metallization) with a thickness of 5-10 microns to realize the three-dimensional circuit formation of the material.