Infrared picosecond laser glass drilling machine

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Infrared picosecond laser glass drilling machine
  • Product description
  • Specifications

    Features: 

    » The laser adopts picosecond laser, which has small cutting edge chipping, high strength after cutting, and small heat-affected area.
    » The optical system uses imported lenses to ensure high-quality optical transmission.
    » The equipment and machine tables are all made of marble stone, which has good flatness, is not easy to deform, and has strong shock resistance and shock absorption ability, ensuring the stability of equipment processing.
    » The equipment adopts imported high-speed galvanometer, with high processing precision and good long-term stability

     

    Sample display:

     

    Infrared Picosecond Glass Drilled Sample

    Infrared Picosecond Glass Drilled Sample

    Infrared Picosecond Glass Drilled Sample

  • Specifications:

     

    Device model TH-G-LD-ps-20
    Effective travel of machine tool cutting  500×500（mm）
    Processing positioning method CCD positioning
    Laser wavelength 1064nm
    laser power 10w 20w 30w optional
    Repeatability 0.005mm
    positioning accuracy ±0.01mm
    Chipping ≤ 20um
    Borehole diameter lower limit 0.1mm
    Single field lens cutting format 50mm×50mm
    Glass thickness range ≤ 1mm
    Machine Dimensions 1540x1460x1752mm
    Total Weight 2300kg

     

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