- Product description
- Specifications
-
Features:
» The machine has a compact structure, takes up little space, and is easy to use. Smaller and more flexible.
» Basic configuration, using imported lasers from Europe and America, combined with a 3D dynamic focusing galvanometer scanning system, the processing speed can reach 40mm/s and the cutting edge chipping is ≤70 um. Sub-picosecond laser cutting chipping ≤ 40um, processing size: 0.1mm-90mm.
» Intelligent CCD vision system, automatic fool-proof recognition, precise positioning calibration, equipment CCD can be used for visual inspection
» Glass laser processing system control core, laser cutting system built on Windows 7 platform, stable performance, easy to use and operate, and can be used according to The program can be upgraded at any time according to the needs of customers. It can process all kinds of through holes, blind square holes, array holes, etc.
» Directly edit or import the cutting program, automatic counting function, set the cutting quantity at will and count the total number of cut products.
Sample display:

Glass Drilled Sample

Glass Drilled Sample

Glass Drilled Sample
-
Device model TH-G-LD-30 Effective travel of machine tool cutting 500×500(mm) Processing positioning method CCD positioning Laser wavelength 532nm laser power 10w 12w 20w 30w optional Repeatability 0.005mm positioning accuracy ±0.01mm Chipping ≤ 70um Borehole diameter lower limit 0.1mm Single field lens cutting format 50mm×50mm Glass thickness range ≤ 6mm Total Weight 2300kg Machine Dimensions 1540x1460x1752mm
The previous one