Laser-Induced Chemical Patterning Deposition Equipment

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    Product description：

    This equipment activates copper ions in chemical solutions via laser induction, which deposit onto the substrate surface to form a copper seed layer. Subsequent electroless copper plating and electrolytic copper plating yield copper patterns featuring excellent electrical conductivity and robust adhesion.
    It realizes in-situ seed layer deposition on 2D planes, 3D surfaces, blind holes and through holes. Boasting a compact process flow and mask-free operation, it is suitable for large-area manufacturing.
    It is applied to the rapid fabrication of 2D planar and 3D stereoscopic PCB circuits. In particular, it enables fast in-situ PCB circuit formation on glass, ceramics, PEEK, PET, PI, photovoltaic silicon cells and other substrates. The process removes the need for PVD, lamination and photolithography, delivering PCB circuits with high efficiency (short workflow), environmental friendliness, high precision, strong interfacial bonding and low resistance.

     

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