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Fully Automatic Wafer Laser Marking Machine

This equipment is mainly aimed at the etching processing of graphics and logos in semiconductor wafers, and uses the corresponding precise positioning and identification system to realize automatic identification of processed parts
Widely used in graphics and logo etching in wafers
Laser power:
3W/5W、20W/30W
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Fully Automatic Wafer Laser Marking Machine
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Number of views:
1000

Fully Automatic Wafer Laser Marking Machine

This equipment is mainly aimed at the etching processing of graphics and logos in semiconductor wafers, and uses the corresponding precise positioning and identification system to realize automatic identification of processed parts
Widely used in graphics and logo etching in wafers
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Number of views:
1000
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Category
Laser marking stripping and paint removal
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Product description
Specifications
Sample display
Laser power:
3W/5W、20W/30W

Features: 

 

» This equipment is mainly aimed at the graphics and logo etching processing in semiconductor wafers. It uses the corresponding precise positioning recognition system to realize automatic identification of workpieces. » It uses
multi-axis robots or handling modules to realize the automatic pick-and-place function and complete automatic processing
» Wide application in wafer graphics and logo etching process

We could not find any corresponding parameters, please add them to the properties table

Specifications: 

 

Device model TH-JYA-FLMS20 TH-JYB-FLMS20 TH-JYB-FLMS3 TH-JYB-FLMS5
laser type Infrared IR UV
Laser wavelength 1064nm 355nm
laser power 20W/30W 3W/5W
Standard Position Accuracy ±0.1mm
Reclaimer Six axis manipulator Multi-Axis Servo Module
Targeting  CCD contour positioning CCD
Machine Dimensions 1200x1600x2000mm 1280x850x1700mm
Laser service life 100,000 hours 15,000 hours

 

Sample display:

 

Wafer marking sample

Wafer marking sample

Wafer Grooving Sample

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