Fully Automatic Wafer Laser Marking Machine

This equipment is mainly aimed at the etching processing of graphics and logos in semiconductor wafers, and uses the corresponding precise positioning and identification system to realize automatic identification of processed parts
Widely used in graphics and logo etching in wafers

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Fully Automatic Wafer Laser Marking Machine
  • Product description
  • Specifications
  • Sample display

    Features: 

     

    » This equipment is mainly aimed at the graphics and logo etching processing in semiconductor wafers. It uses the corresponding precise positioning recognition system to realize automatic identification of workpieces. » It uses
    multi-axis robots or handling modules to realize the automatic pick-and-place function and complete automatic processing
    » Wide application in wafer graphics and logo etching process

  • Specifications: 

     

    Device model TH-JYA-FLMS20 TH-JYB-FLMS20 TH-JYB-FLMS3 TH-JYB-FLMS5
    laser type Infrared IR UV
    Laser wavelength 1064nm 355nm
    laser power 20W/30W 3W/5W
    Standard Position Accuracy ±0.1mm
    Reclaimer Six axis manipulator Multi-Axis Servo Module
    Targeting  CCD contour positioning CCD
    Machine Dimensions 1200x1600x2000mm 1280x850x1700mm
    Laser service life 100,000 hours 15,000 hours

     

  • Sample display:

     

    Wafer marking sample

    Wafer marking sample

    Wafer Grooving Sample

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