Fully automatic wafer splitter

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Fully automatic wafer splitter
  • Product description
  • Specifications

    Features: 

    » This equipment is mainly developed for GPP wafers as an automatic splitting device; it is equipped with automatic loading and unloading, Z-axis pressure sensing, visual angle correction, double-wafer detection, and automatic liquid spraying functions; » The equipment has high mechanical yield and fast splitting
    efficiency ;
    » Full Chinese operation interface, intuitive and simple operation, good interface;
    » Process parameters can be stored and retrieved, easy to operate;
    » Pressure value sensing, graph display;
    » Automatic draining system.

     

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