Solar shingled laser processing system

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Solar shingled laser processing system
  • Product description
  • Specifications
  • Sample display

    Features: 

    » Assembly line loading and unloading structure, saving space.
    » Unique vertical chip breaking system, eliminate chip stress, higher yield.
    » Imported laser and core components, high stability, high reliability.
    » High production capacity, 2500 pieces/hour, 5000 pieces/hour.
    » In-line integration with most multi-busbar stringing systems.
    » The feeding inspection system can reject unqualified film sources when incoming materials.
    » The blanking detection system can separate broken pieces and large and small pieces, avoiding the waste of time for production line shutdown and rectification.

  • Specifications:

     

    Device model Solar Shingled Laser Processing System
    Wafer size 156mmX156mm / 166mmX166mm
    UPH ≥ 3600PCS/H, 2-slice burst, the device has 2-slice, N-slice function (N=3~6)
    uptime ≥ 98%
    MTBF ≥ 250 hours
    mean recovery time ≤ 12 hours
    Full production rate ≥ 99.90%
    Fragmentation rate ≤ 0.03%
    Cutting accuracy ≤ 0.1mm
    cutting depth 10%-90% adjustable, there is no obvious burr in the crack
    Other functions 1. Automatic loading and unloading, cutting and splitting
    2. Fragment detection function
    3. Can quickly upgrade the automatic connection stringer
    4. Quickly upgrade laminations

     

  • Sample display:

     

    Sample of solar shingling laser processing system

    Sample of solar shingling laser processing system

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